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ADRF5440BCDZ-R7 Datasheet(PDF) 16 Page - Analog Devices

No. de pieza ADRF5440BCDZ-R7
Descripción Electrónicos  Flip Chip, Silicon SP4T Switch, 1GHz to 81GHz
PDF  18 Pages
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

ADRF5440BCDZ-R7 Datasheet(HTML) 16 Page - Analog Devices

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Data Sheet
ADRF5440
APPLICATIONS INFORMATION
analog.com
Rev. A | 16 of 18
RECOMMENDATIONS FOR PCB DESIGN
The RF ports are matched to 50Ω internally, and the pinout is
designed to mate a coplanar waveguide (CPWG) with 50Ω charac-
teristic impedance on the PCB. Figure 26 shows the referenced
CPWG design for a 150µm thick Megtron6 2×1080 R‑5775G dielec-
tric material. The RF trace with 300µm width and 300µm gap is
used for 42µm finished copper thickness.
Figure 26. Probe Board Stackup
Figure 27. Recommended RF Pin Transitions
Table 8 shows the recommended layout from the device RF pins
to the 50Ω CPWG. Signal pads have a 170µm diameter extended
with a neck for broadband tuning and tapered to RF trace with a 45°
angle. The optimized RF pin transitions for broadband performance
is given for different stackups in Table 8. For further recommenda-
tions on alternate PCB stackups with different dielectric thickness
and CPWG design, contact Analog Devices, Inc., Analog Devices
Support.
Table 8. Recommended RF Pin Transitions for Different Stackups
RF Stack-Up Height and Dielectric
RF Trace Dimensions
ADRF5440 Mnemonic
Transition Dimensions
H (µm)
Er
W (µm)
G (μm)
N (µm)
L (µm)
85
3.02
180
250
RFC, RF1, and RF4
120
90
RF2 and RF3
120
190
100
3.34
200
225
RFC, RF1, and RF4
120
90
RF2 and RF3
120
140
115
3.40
225
250
RFC, RF1, and RF4
120
90
RF2 and RF3
120
140
125
3.00
250
225
All
120
90
1501
3.40
300
300
All
120
90
175
3.16
360
245
All
170
90
190
3.00
425
225
All
170
90
200
3.55
425
275
All
170
90
1 Design reference and generic footprint.



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