Data Sheet

ADRF5440

TABLE OF CONTENTS

analog.com

Rev. A | 2 of 18

Features................................................................ 1

Applications .......................................................... 1

Functional Block Diagram......................................1

General Description...............................................1

Specifications........................................................ 3

Electrical Specifications......................................3

Single-Supply Operation.................................... 4

Absolute Maximum Ratings...................................5

Thermal Resistance........................................... 5

Power Derating Curves...................................... 5

Electrostatic Discharge (ESD) Ratings...............6

ESD Caution.......................................................6

Pin Configuration and Function Descriptions........ 7

Interface Schematics..........................................9

Typical Performance Characteristics................... 10

Insertion Loss, Return Loss, and Isolation....... 10

Input Power Compression and Third-Order

Intercept ........................................................ 12

Theory of Operation.............................................13

RF Input and Output.........................................14

Power Supply................................................... 14

Applications Information...................................... 15

Recommendations for PCB Design..................16

Die Assembly .................................................. 17

Outline Dimensions............................................. 18

Ordering Guide.................................................18

REVISION HISTORY

11/2025—Rev. 0 to Rev. A

Change to Features Section............................................................................................................................ 1

Changes to Applications Section..................................................................................................................... 1

Changes to General Description Section.........................................................................................................1

Changes to Table 6..........................................................................................................................................7

Change to Insertion Loss, Return Loss, and Isolation Section...................................................................... 10

Changes to Input Power Compression and Third-Order Intercept Section....................................................12

Changes to Recommendations for PCB Design Section, Figure 26, Figure 27 Caption, and Table 8 Title...16

Changes to Die Assembly Section.................................................................................................................17

Changes to Reflow Assembly with Solder Paste Section.............................................................................. 17

Changes to Reflow Assembly with Flux Dipping Section...............................................................................17

Change to Assembly Durability Section.........................................................................................................17

9/2025—Revision 0: Initial Version