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XC6224 Datasheet(PDF) 21 Page - Torex Semiconductor |
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XC6224 Datasheet(HTML) 21 Page - Torex Semiconductor |
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21 / 26 page ![]() 21/26 XC6224 Series ● SOT-25 Power Dissipation Board Mount (Tj max = 125℃) Ambient Temperature(℃) Power Dissipation Pd(mW) Thermal Resistance (℃/W) 25 600 85 240 166.67 Pd-Ta特性グラフ 0 100 200 300 400 500 600 700 25 45 65 85 105 125 周辺温度Ta(℃) ■PACKAGING INFORMATION (Continued) Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient temperature Pd vs. Ta Ambient Temperature Ta (℃) 評価基板レイアウト(単位:mm) Evaluation Board (Unit: mm) |
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