ADC128S102_15 datasheet(4/29 Pages) TI1

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ADC128S102

SNAS298G – AUGUST 2005 – REVISED JANUARY 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

See

(1) (2).

MIN

MAX

UNIT

Analog Supply Voltage VA

−0.3

6.5

Digital Supply Voltage VD

−0.3

VA + 0.3, max 6.5

Voltage on Any Pin to GND

−0.3

VA +0.3

Input Current at Any Pin (3)

–10

Package Input Current(3)

–20

Power Dissipation at TA = 25°C

See (4)

Junction Temperature

150

°C

Storage temperature, Tstg

−65

150

°C

For soldering specifications: see product folder at www.ti.com and SNOA549

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND or VIN > VA or VD), the current at that pin should be

limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies

with an input current of 10 mA to two.

(4)

The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by

TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula

PDMAX = (TJmax − TA)/θJA. In the 16-pin TSSOP, θJA is 96°C/W, so PDMAX = 1,200 mW at 25°C and 625 mW at the maximum

operating ambient temperature of 105°C. Note that the power consumption of this device under normal operation is a maximum of 12

mW. The values for maximum power dissipation listed above will be reached only when the ADC128S102 is operated in a severe fault

condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed).

Obviously, such conditions should always be avoided.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V(ESD)

Electrostatic discharge

Machine model (MM)

±250

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Operating Temperature, TA

–40

105

°C

VA Supply Voltage

2.7

5.25

VD Supply Voltage

2.7

Digital Input Voltage

Analog Input Voltage

Clock Frequency

MHz

(1)

All voltages are measured with respect to GND = 0V, unless otherwise specified.

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