date 09/07/2017

page 1 of 7

cui.com

SERIES: HSE-B18X-035H

│ DESCRIPTION: HEAT SINK

FEATURES

• TO-218 package

• placement pins for secure PCB attachment

• round hole for component attachment

• multiple available cut lengths

MODEL

power

length

(mm)

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

HSE-B18254-035H

25.4

9.26

13.52

3.09

2.86

8.10

HSE-B18317-035H

31.75

7.65

10.96

3.63

2.80

9.80

HSE-B18381-035H

38.1

6.25

8.34

3.52

2.48

12.00

HSE-B18508-035H

50.8

5.86

8.63

2.98

2.21

12.80

HSE-B18635-035H

63.5

4.49

6.61

2.24

1.22

16.70

Note:

1. See performance curves for full thermal resistance details.

2. Custom cut to length options available. Thermal data not available on custom lengths.

PERFORMANCE CURVES

0

10

20

30

40

50

60

70

80

90

100

01

2345

Dissipated Power (W)

678

910

Without Airflow

200 LFM

400 LFM

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

Power

(W)

Natural

Conv.

200 LFM

400 LFM

0

0

0

0

1

13.52

3.09

2.86

2

24.58

6.19

4.94

3

33.71

9.47

7.42

4

42.65

12.64

9.60

5

51.54

15.85

12.11

6

58.98

18.94

14.54

7

67.25

22.34

16.84

8

74.76

25.54

19.31

9

82.16

28.87

21.66

10

89.43

31.89

23.95

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

HSE-B18254-035H

For more information, please visit the product page.