AD5671R datasheet(10/32 Pages) AD

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AD5674/AD5674R/AD5679/AD5679R

Data Sheet

Rev. B | Page 10 of 32

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 7.

Parameter

Rating

VDD to GND

−0.3 V to +7 V

VLOGIC to GND

−0.3 V to +7 V

VOUTX to GND

−0.3 V to VDD + 0.3 V

VREF to GND

−0.3 V to VDD + 0.3 V

Digital Input Voltage to GND

−0.3 V to VLOGIC + 0.3

Operating Junction Temperature

Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Absolute Maximum Junction

Temperature

150°C

Reflow Soldering Peak Temperature,

Pb-Free (J-STD-020)

260°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot, sealed enclosure. θJB is the junction

to board thermal resistance. θJC is the junction to case thermal

resistance. ΨJT is the junction to top thermal characterization

parameter. ΨJB is the junction to board thermal characterization

parameter.

Table 8. Thermal Resistance

Package Type1

θJA

θJB

θJC

ΨJT

ΨJB

Unit

CP-28-8

55.09

24.49

19.14

2.62

23.92

°C/W

Thermal impedance simulated values are based on a JEDEC 2S2P thermal test

board with nine thermal vias. See JEDEC JESD51.

ESD CAUTION

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