AD6623BCSLASHPCB datasheet(38/40 Pages) AD

38 / 40 page

REV. 0

AD6623

–38–

COEFFICIENT

1.0

0.5

0.0

Figure 37. Typical Impulse Response for WBCDMA

kHz

1000

–10

–20

–30

–40

–50

–60

–70

–80

–90

–100

2000 3000 4000 5000 6000 7000 8000 9000 10000

Figure 38. RAM Coefficient Filter, Frequency Response for

WBCDMA

kHz

1000

–10

–20

–30

–40

–50

–60

–70

–80

–90

–100

2000 3000 4000 5000 6000 7000 8000 9000 10000

CIC ROLLOFF

COMPOSITE

AD6623 RESPONSE

IDEAL

FILTER

Figure 39. RCF and CIL, Frequency Response for WBCDMA

THERMAL MANAGEMENT

The power dissipation of the AD6623 is primarily determined

by three factors: the clock rate, the number of channels active,

and the distribution of interpolation rates. The faster the clock

rate the more power dissipated by the CMOS structures of the

AD6623 and the more channels active the higher the overall

power of the chip. Low interpolation rates in the CIC stages

(CIC5, CIC2) results in higher power dissipation. All these

factors should be analyzed as each application has different

thermal requirements.

The AD6623 128-Lead MQFP is specially designed to provide

excellent thermal performance. To achieve the best performance

the power and ground leads should be connected directly to planes

on the PC board. This provides the best thermal transfer from the

AD6623 to the PC board.

AD6623BC/PCB Datasheet(PDF) 38 Page - Analog Devices

AD6623BC/PCB Datasheet(HTML) 38 Page - Analog Devices

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