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SP6123 Datasheet(PDF) 16 Page - Exar Corporation |
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SP6123 Datasheet(HTML) 16 Page - Exar Corporation |
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16 / 18 page ![]() 16 Date: 9/13/04 SP6123 Low Voltage, Synchronous Step Down PWM Controller © Copyright 2004 Sipex Corporation PCB layout plays a critical role in proper func- tion of the converters and EMI control. In switch mode power supplies, loops carrying high di/dt give rise to EMI and ground bounces. The goal of layout optimization is to identify these loops and minimize them. It is also crucial on how to connect the controller ground such that its op- eration is not affected by noise. The following guideline should be followed to ensure proper operation. 1. A ground plane is recommended for minimiz- ing noises, copper losses and maximizing heat dissipation. 2. Begin the layout by placing the power compo- nents first. Orient the power circuitry to achieve a clean power flow path. If possible make all the connections on one side of the PCB with wide, copper filled areas. 3. Connect the ground of feedback divider and compensation components directly to the GND pin of the IC using a dedicated ground trace. Then connect this pin as close as possible to the ground of the output capacitor. 4. The VCC bypass capacitor should be right next to the VCC and GND pins. 5. The trace connecting the feedback resistors to the output should be short, direct and far away from the switch node, and switching compo- nents. 6. Minimize the trace between GH/GL and the gates of the MOSFETs to reduce the impedance driving the MOSFETs. This is especially impor- tant for the bottom MOSFET that tends to turn on through its Miller capacitor when the switch node swings high. 7. Minimize the loop composed of input capaci- tors, top/bottom MOSFETs and Schottky diode. This loop carries high di/dt current. Also in- crease the trace width to reduce copper losses. 8. Maximize the trace width of the loop connect- ing the inductor, output capacitors, Schottky diode and bottom MOSFET. LAYOUT GUIDELINE |
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