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DMC3025LSD Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMC3025LSD Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 10 page ![]() DMC3025LSD Document number: DS35717 Rev. 7 - 2 2 of 10 www.diodes.com February 2015 © Diodes Incorporated DMC3025LSD Maximum Ratings N-CHANNEL– Q2 (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS 30 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 5) VGS = 10V Steady State TA = +25°C TA = +70°C ID 6.5 5.1 A t<10s TA = +25°C TA = +70°C ID 8.5 6.8 A Continuous Drain Current (Note 5) VGS = 4.5V Steady State TA = +25°C TA = +70°C ID 5.3 4.1 A t<10s TA = +25°C TA = +70°C ID 7.0 5.5 A Maximum Continuous Body Diode Forward Current (Note 5) IS 2 A Pulsed Drain Current (10µs pulse, duty cycle = 1%) IDM 60 A Pulsed Body Diode Current (10µs pulse, duty cycle = 1%) ISM 60 A Avalanche Current (Note 7) L = 0.1mH IAS 14 A Avalanche Energy (Note 7) L = 0.1mH EAS 10 mJ Maximum Ratings P-CHANNEL– Q1 (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS -30 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 5) VGS = -10V Steady State TA = +25°C TA = +70°C ID -4.2 -3.2 A t<10s TA = +25°C TA = +70°C ID -5.5 -4.3 A Continuous Drain Current (Note 5) VGS = -4.5V Steady State TA = +25°C TA = +70°C ID -3.5 -2.3 A t<10s TA = +25°C TA = +70°C ID -4.1 -3.2 A Maximum Continuous Body Diode Forward Current (Note 5) IS -2 A Pulsed Drain Current (10µs pulse, duty cycle = 1%) IDM -30 A Pulsed Body Diode Current (10µs pulse, duty cycle = 1%) ISM -30 A Avalanche Current (Note 7) L = 0.1mH IAS -14 A Avalanche Energy (Note 7) L = 0.1mH EAS 10 mJ Thermal Characteristics Characteristic Symbol Value Units Total Power Dissipation (Note 6) TA = +25°C PD 1.2 W TA = +70°C 0.77 Thermal Resistance, Junction to Ambient (Note 6) Steady State RθJA 104 °C/W t<10s 62 Total Power Dissipation (Note 5) TA = +25°C PD 1.5 W TA = +70°C 0.95 Thermal Resistance, Junction to Ambient (Note 5) Steady State RθJA 83 °C/W t<10s 49 Thermal Resistance, Junction to Case (Note 5) RθJC 15 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. |
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