September 1992

13

Philips Semiconductors

Product specification

HF/VHF power MOS transistor

BLF177

Fig.20 Component layout for 108 MHz class-B test circuit.

The circuit and components are situated on one side of the epoxy fibre-glass board, the other side being fully

metallized to serve as earth. Earth connections are made by means of hollow rivets, whilst under the source

leads and at the input and output copper straps are used for a direct contact between upper and lower sheets.

Dimensions in mm.

handbook, full pagewidth

MGP105

174

70

strap

strap

strap

rivet

C1

C2

C3

C4

C8

C6

C7

C5

L2

L1

L3

R1

R2

R3

R4

L4

L7

L5

L8

C14

C13

C12

+VD

R6

L6

R5

C10

C11

C9

C15

C19

C16

C18

C17