| Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
BLF177 Datasheet(PDF) 3 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
BLF177 Datasheet(HTML) 3 Page - NXP Semiconductors |
|
3 / 16 page ![]() September 1992 3 Philips Semiconductors Product specification HF/VHF power MOS transistor BLF177 LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). THERMAL RESISTANCE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-source voltage − 110 V ±VGS gate-source voltage − 20 V ID DC drain current − 16 A Ptot total power dissipation up to Tmb = 25 °C − 220 W Tstg storage temperature −65 150 °C Tj junction temperature − 200 °C SYMBOL PARAMETER THERMAL RESISTANCE Rth j-mb thermal resistance from junction to mounting base max. 0.8 K/W Rth mb-h thermal resistance from mounting base to heatsink max. 0.2 K/W Fig.2 DC SOAR. (1) Current is this area may be limited by RDS(on). (2) Tmb = 25 °C. handbook, halfpage 102 10 1 10−1 MRA906 110 VDS (V) ID (A) 102 103 (1) (2) Fig.3 Power/temperature derating curves. (1) Short-time operation during mismatch. (2) Continuous operation. handbook, halfpage 0 300 200 100 0 50 (2) (1) 100 150 MGP089 Ptot (W) Th (°C) |
|
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |