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A25GFO080QL Datasheet(PDF) 7 Page - AMIC Technology |
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A25GFO080QL Datasheet(HTML) 7 Page - AMIC Technology |
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7 / 58 page ![]() A25LQ080 Series (April, 2016, Version 1.0) 6 AMIC Technology Corp. OPERATING FEATURES Page Programming To program one data byte, two instructions are required: Write Enable (WREN), which is one byte, and a Page Program (PP) sequence, which consists of four bytes plus data. This is followed by the internal Program cycle (of duration tPP). To spread this overhead, the Page Program (PP) instruction allows up to 256 bytes to be programmed at a time (changing bits from 1 to 0), provided that they lie in consecutive addresses on the same page of memory. Dual Input Fast Program The Dual Input Fast Program (DIFP) instruction makes it possible to program up to 256 bytes using two input pins at the same time (by changing bits from 1 to 0). For optimized timings, it is recommended to use the Dual Input Fast Program (DIFP) instruction to program all consecutive targeted bytes in a single sequence rather to using several Dual Input Fast Program (DIFP) sequences each containing only a few bytes. Quad Input Fast Program The Quad Input Fast Program (QIFP) instruction makes it possible to program up to 256 bytes using four input pins (IO3, IO2, IO1, and IO0) at the same time (by changing bits from 1 to 0). For optimized timings, it is recommended to use the Quad Input Fast Program (QIFP) instruction to program all consecutive targeted bytes in a single sequence rather to using several Quad Input Fast Program (QIFP) sequences each containing only a few bytes. Sector Erase, Block Erase, and Chip Erase The Page Program (PP) instruction, Dual Input Fast Program (DIFP) instruction, and Quad Input Fast Program (QIFP) instruction allow bits to be reset from 1 to 0. Before this can be applied, the bytes of memory need to have been erased to all 1s (FFh). This can be achieved, a sector at a time, using the Sector Erase (SE) instruction, a block at a time, using the Block Erase (BE) instruction, or throughout the entire memory, using the Chip Erase (CE) instruction. This starts an internal Erase cycle (of duration tSE, tBE, or tCE). The Erase instruction must be preceded by a Write Enable (WREN) instruction. Polling During a Write, Program or Erase Cycle A further improvement in the time to Write Status Register (WRSR), Program OTP (POTP), Program (PP, DIFP, QIFP), or Erase (SE, BE, or CE) can be achieved by not waiting for the worst case delay (tW, tPP, tSE, tBE, tCE). The Write In Progress (WIP) bit is provided in the Status Register so that the application program can monitor its value, polling it to establish when the previous Write cycle, Program cycle or Erase cycle is complete. Active Power, Stand-by Power and Deep Power-Down Modes When Chip Select ( S ) is Low, the device is enabled, and in the Active Power mode. When Chip Select ( S ) is High, the device is disabled, but could remain in the Active Power mode until all internal cycles have completed (Program, Erase, Write Status Register). The device then goes in to the Stand-by Power mode. The device consumption drops to ICC1. The Deep Power-down mode is entered when the specific instruction (the Deep Power-down Mode (DP) instruction) is executed. The device consumption drops further to ICC2. The device remains in this mode until another specific instruction (the Release from Deep Power-down Mode and Read Electronic Signature (RES) instruction) is executed. All other instructions are ignored while the device is in the Deep Power-down mode. This can be used as an extra software protection mechanism, when the device is not in active use, to protect the device from inadvertent Write, Program or Erase instructions. Status Register The Status Register contains a number of status and control bits that can be read or set (as appropriate) by specific instructions. See Read Status Register (RDSR) for a detailed description of the Status Register bits. Protection Modes The environments where non-volatile memory devices are used can be very noisy. No SPI device can operate correctly in the presence of excessive noise. To help combat this, the A25LQ080 boasts the following data protection mechanisms: Power-On Reset and an internal timer (tPUW) can provide protection against inadvertent changes while the power supply is outside the operating specification. Program, Erase and Write Status Register instructions are checked that they consist of a number of clock pulses that is a multiple of eight, before they are accepted for execution. All instructions that modify data must be preceded by a Write Enable (WREN) instruction to set the Write Enable Latch (WEL) bit. This bit is returned to its reset state by the following events: - Power-up - Write Disable (WRDI) instruction completion - Write Status Register (WRSR) instruction completion - Program OTP (POTP) instruction completion - Page Program (PP) instruction completion - Dual Input Fast Program (DIFP) instruction completion - Quad input Fast Program (QIFP) instruction completion - Sector Erase (SE) instruction completion - Block Erase (BE) instruction completion - Chip Erase (CE) instruction completion The Block Protect (BP2, BP1, BP0) bits conjunction with Sector Protect (SEC) bit , Top/Bottom (TB) bit and Complement Protect (CMP) bit allow part of the memory to be configured as read-only. This is the Software Protected Mode (SPM). The Write Protect ( W ) signal allows the Block Protect (BP2, BP1, BP0) bits, Sector Protect (SEC) bit, Top/Bottom (TB) bit, All Protect (APT), Complement Protect (CMP) bit and Status Register Protect (SRP0) bit to be protected. This is the Hardware Protected Mode (HPM). In addition to the low power consumption feature, the Deep Power-down mode offers extra software protection from inadvertent Write, Program and Erase instructions, as all instructions are ignored except one particular instruction (the Release from Deep Power-down instruction). |
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