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VN5E160AS-E Datasheet(PDF) 29 Page - STMicroelectronics |
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VN5E160AS-E Datasheet(HTML) 29 Page - STMicroelectronics |
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29 / 37 page ![]() VN5E160AS-E Package and PCB thermal data Doc ID 15609 Rev 4 29/37 4 Package and PCB thermal data 4.1 SO-8 thermal data Figure 35. SO-8 PC board(1) 1. Layout condition of Rth and Zth measurements (PCB: FR4 area = 4.8 mm x 4.8 mm, PCB thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to 2 cm2). Figure 36. Rthj-amb vs PCB copper area in open box free air condition 60 70 80 90 100 110 0 0.5 1 1.5 2 2.5 RTHj_amb(°C/W) PCB Cu heatsink area (cm^2) |
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