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ADS6445 Datasheet(PDF) 67 Page - STMicroelectronics |
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ADS6445 Datasheet(HTML) 67 Page - STMicroelectronics |
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67 / 75 page ![]() www.ti.com BOARD DESIGN CONSIDERATIONS Grounding Supply Decoupling Exposed Thermal Pad ADS6445, ADS6444 ADS6443, ADS6442 SLAS531 – MAY 2007 A single ground plane is sufficient to give optimum performance, provided the analog, digital and clock sections of the board are cleanly partitioned. Refer to the EVM User Guide (SLAU196) for board layout schemes. As the ADS644X already includes internal decoupling, minimal external decoupling can be used without loss in performance. Note that the decoupling capacitors can help to filter external power supply noise, so the optimum number of decoupling capacitors would depend on actual application. It is recommended to use separate supplies for the analog and digital supply pins to isolate digital switching noise from sensitive analog circuitry. In case only a single 3.3-V supply is available, it should be routed first to AVDD. It can then be tapped and isolated with a ferrite bead (or inductor) with decoupling capacitor, before being routed to LVDD. It is necessary to solder the exposed pad at the bottom of the package to a ground plane for best thermal performance. For detailed information, see application notes QFN Layout Guidelines (SLOA122A) and QFN/SON PCB Attachment (SLUA271A). 67 Submit Documentation Feedback |
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