Package and PCB thermal data

VN610SP-E

20/27

Doc ID 10889 Rev 5

4

Package and PCB thermal data

4.1

PowerSO-10 thermal data

Figure 21.

PowerSO-10 PC board(1)

1.

Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB thickness = 2mm,

Cu thickness = 35µm, Copper areas: from minimum pad-lay-out to 8cm2).

Figure 22.

Rthj-amb vs PCB copper area in open box free air condition

30

35

40

45

50

55

02

4

6

8

10

PCB Cu heatsink area (cm^2)

RTHj_amb (°C/W)

Tj-Tamb=50°C