ADP3330

Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications....................................................................................... 1

Simplified Functional Block Diagram ........................................... 1

General Description......................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

ADP3330........................................................................................ 3

ADP3330-2.5................................................................................. 4

Absolute Maximum Ratings............................................................ 5

ESD Caution.................................................................................. 5

Pin Configuration and Function Descriptions............................. 6

Typical Performance Characteristics ............................................. 7

Theory of Operation ...................................................................... 10

Applications Information .............................................................. 11

Capacitor Selection .................................................................... 11

Noise Reduction ......................................................................... 11

Chip-on-Lead Package .............................................................. 11

Thermal Overload Protection .................................................. 11

Calculating Junction Temperature........................................... 12

Printed Circuit Board (PCB) Layout Considerations ........... 12

Error Flag Dropout Detector.................................................... 12

Shutdown Mode ......................................................................... 12

Low Power, Low Dropout Applications .................................. 12

Application Circuits ....................................................................... 13

Crossover Switch ........................................................................ 13

Higher Output Current ............................................................. 13

Outline Dimensions....................................................................... 14

Ordering Guide .......................................................................... 14

REVISION HISTORY

5/15—Rev. B to Rev. C

Changes to General Description Section ...................................... 1

Changes to Chip-On-Lead Package Section............................... 11

Changes to Ordering Guide .......................................................... 14

5/14—Rev. A to Rev. B

Updated Format..................................................................Universal

Changed 0.47 mF to 0.47 µF, Features Section ............................. 1

Changes to General Description Section ...................................... 1

Changed −2.5 V to 2.5 V, ADP3330-xx Section .......................... 3

Changes to Table 1............................................................................ 3

Changes to Table 2............................................................................ 4

Changes to Figure 4 Caption through Figure 7 Caption............. 7

Changes to Figure 10, Figure 13 Caption, Figure 14 Caption,

and Figure 15..................................................................................... 8

Changes to Figure 16, Figure 17, and Figure 19 Caption............ 9

Changes to Printed Circuit Board (PCB) Layout Considerations

Section, and Low Power, Low Dropout Applications Section.. 12

Updated Outline Dimensions....................................................... 14

Changes to Ordering Guide .......................................................... 14

8/99—Rev. 0 to Rev. A

Rev. C | Page 2 of 16