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WM8741GEDS/V Datasheet(PDF) 9 Page - Wolfson Microelectronics plc |
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WM8741GEDS/V Datasheet(HTML) 9 Page - Wolfson Microelectronics plc |
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9 / 64 page ![]() Production Data WM8741 w PD, Rev 4.2, October 2009 9 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified. ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device. Wolfson Microelectronics tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage conditions prior to surface mount assembly. These levels are: MSL1 = unlimited floor life at <30 °C / 85% Relative Humidity. Not normally stored in moisture barrier bag. MSL2 = out of bag storage for 1 year at <30 °C / 60% Relative Humidity. Supplied in moisture barrier bag. MSL3 = out of bag storage for 168 hours at <30 °C / 60% Relative Humidity. Supplied in moisture barrier bag. The Moisture Sensitivity Level for each package type is specified in Ordering Information. CONDITION MIN MAX Digital supply voltage, DVDD -0.3V +4.5V Analogue supply voltage, AVDD -0.3V +7V Voltage range digital inputs DGND - 0.3V DVDD + 0.3V Voltage range analogue inputs AGND - 0.3V AVDD + 0.3V Master Clock Frequency 38.462MHz Operating temperature range, TA -40°C +85°C Storage temperature -65°C +150°C Ambient temperature (supplies applied) -55°C +125°C Pb free package body temperature (soldering 10 seconds) +260°C Pb free package body temperature (soldering 2 minutes) +183°C Notes: 1. Analogue and digital grounds must always be within 0.3V of each other. THERMAL PERFORMANCE PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Thermal resistance – junction to case θJC 23.9 °C/W Thermal resistance – junction to ambient θJA 67.1 °C/W |
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