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ZIOL2201 Datasheet(PDF) 1 Page - Renesas Technology Corp |
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ZIOL2201 Datasheet(HTML) 1 Page - Renesas Technology Corp |
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1 / 92 page  IO-Link Compliant HV Line Driver IC Family ZIOL2xxx Datasheet © 2016 Integrated Device Technology, Inc. 1 April 26, 2016 Contents 1 The ZIOL2xxx IC Family Overview .......................................................................................5 2 Electrical Characteristics ......................................................................................................6 2.1. Absolute Maximum Ratings ............................................................................................6 2.2. Operating Conditions ......................................................................................................7 2.3. Electrical Parameters ......................................................................................................8 3 Detailed Description............................................................................................................13 3.1. Block schematic ............................................................................................................13 3.2. Dual Channel Transceiver.............................................................................................14 3.2.1. IC Data Path Configuration ......................................................................................14 3.2.2. Transmitter ..............................................................................................................18 3.2.3. Receiver ..................................................................................................................20 3.3. System Control .............................................................................................................22 3.3.1. General....................................................................................................................22 3.3.2. IO-Link Master and Device Mode ............................................................................23 3.3.3. Internal Exceptions ..................................................................................................23 3.3.4. IO-Link specific Wake-Up (WURQ)..........................................................................23 3.3.5. IC Self-Protection – Lock Mode ...............................................................................25 3.3.6. Channel Locking in Master/Device Mode ................................................................27 3.3.7. Memory Unit ............................................................................................................27 3.3.8. Serial Peripheral Interface (SPI) ..............................................................................29 3.3.9. Register Table / Registers for IC Configuration and Monitoring...............................34 3.3.10.Interrupt and IC Lock Mode Control.........................................................................44 3.3.11.Die Temperature Measurement ...............................................................................51 3.4. Smart Power Supply .....................................................................................................51 3.5. The Power Fail Detector ...............................................................................................53 3.5.1. Overview..................................................................................................................53 3.5.2. Line-Fault Detector ..................................................................................................53 3.5.3. Under-voltage Detector............................................................................................54 3.5.4. Channel Locking and Interrupt Generation ..............................................................54 3.5.5. Downward Compatibility ..........................................................................................54 3.6. DC/DC Converter ..........................................................................................................54 3.6.1. Principle of Operation ..............................................................................................54 3.6.2. Principle of Operation ..............................................................................................55 3.6.3. Dimensioning of external Devices............................................................................56 |
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