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ZIOL2201 Datasheet(PDF) 11 Page - Renesas Technology Corp |
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ZIOL2201 Datasheet(HTML) 11 Page - Renesas Technology Corp |
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11 / 92 page ![]() ZIOL2xxx Datasheet © 2016 Integrated Device Technology, Inc. 11 April 26, 2016 Symbol Parameter Min Typ 1) Max Unit Conditions Microcontroller Interface 9) VLIH Voltage range for input ”high” level 2.5 5.5 V @ VDD_LV = 3.6V, otherwise VLIH-min = 0.7 ∗ VDD_LV VLIL Voltage range for input ”low” level -0.3 0.9 V @ VDD_LV = 3.0V, otherwise VLIL-max = 0.3 ∗ VDD_LV ILIH Logic “high” input current @ pins without pull-up/pull-down resistors: INT_L, WURQ_L -1 1 µA @ VLIH = VDD_LV ILIL Logic “low” input current -1 1 µA @ VLIL = 0V ILIH_PD Logic “high” input current @ pins with pull- down resistors: TX_EN/SPI_CLK, TX/MOSI, AUX_EN, AUX_TX, DC_RDY -300 -150 µA @ VLIH = VDD_LV-max = 3.6V @ VLIH = 5.5V, VDD_LV-max = 3.6V ILIL_PD Logic “low” input current -1 1 µA @ VLIL = 0V, VDD_LV-max = 3.6V @ VLIL = 0V, VDD_LV-max = 3.0V ILIH_PU Logic “high” input current @ pins with pull- up resistors: RST_L, SPI_EN_L -1 1 µA @ VLIH-min = VDD_LV-max = 3.0V @ VLIH-max = VDD_LV-max = 3.6V ILIL_PU Logic “low” input current -150 250 µA @ VLIL = 0V, VDD_LV-max = 3.6V @ VLIL = -0.3V, VDD_LV-max = 3.6V VLOL Logic “high” output voltage @ output pins: RX/MISO, AUX_RX 0 5 % ∗V DD_LV @ ILIL = 1mA VLOH Logic “high” output voltage 95 100 % ∗V DD_LV @ ILIH = -1mA Internal Current Consumption 10) IVDD Current into VDD 1.7 2.5 mA SPI_EN=3.3V ILR_IN Current into LR_IN 2.2 3.4 mA SPI_EN=3.3V 1) The mentioned typical values of IC properties are provided for information only and shall not be considered as statistical guaranteed mean values. Typical values are not subject for measurement while the electrical test of each IC – they are correct by design. 2) If the output current exceeds the configured current limit, the IC will raise an overload signal which causes up-counting of the overload counter (if configured) and which definitely limits the output current. However, the current limit will be performed after a certain settling time in order to ensure the configured slope of the output signal. 3) Absolute edge rise and fall times are proportional to VDD_HV 4) A minimum of the output current must be provided by the application circuit. Otherwise the DC/DC converter shall be unused by interconnecting the FB pin with the LR_OUT pin. The required voltage divider (refer to Figure 3.21) may provide this current partly or in full. 5) Slew-rate measured after settlement time of the output signal 6) Configurable with an external voltage divider (refer to chapter 3.5) 7) The ripple on the output voltage depends significantly on both the external components and the PCB layout. Reference PCB layouts are available from IDT. The layouts used in the application kits are shown in Figure 4.4; detailed layout data of the application kits are available from IDT upon request. 8) The efficiency of the DC/DC converter is depending on the external components and the used PCB layout. Moreover, there is an influence from several operational conditions which is illustrated in the diagram of Figure 2.2 9) Microcontroller interface pins are : RST_L, SPI_EN_L, INT_L, WURQ_L, TX_EN/SPI_CLK, TX/MOSI, RX/MISO, AUX_EN, AUX_TX, AUX_RX, DC_RDY 10) Current consumption is measured by applying the maximum supply voltage at the supply pins VDD and LR_IN (VVDD_HV=36V, Vin=36V) and using a decoupling cap of 10µF between LR_OUT and ground. Both VDD and both VSS pins are interconnected, respectively. Pins TX_EN/SPI_CLK, AUX_TX, TX_EN, AUX_EN, PFD, COM_I, AUX_I are connected to ground. |
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