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Revision 1.01

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AS1160/AS1161

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

AVDD, DVDD

-0.3

+4

V

LVCMOS/LVTTL Input

-0.3

0.3

V

LVCMOS/LVTTL Output

-0.3

0.3

V

Bus LVDS Receiver Input/Output

-0.3

+3.9

V

Bus LVDS Output Short-Circuit Duration

10

ms

Power Dissipation

1.47

W

Derate at 11.8mW/ºC above 25ºC

85

ºC/W

ESD

2

kV

HBM MIL-Std. 883E 3015.7 methods;

Operating Temperature

-40

+85

ºC

Storage Temperature

-65

+150

ºC

Junction Temperature

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020D “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).