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STM32F302XD Datasheet(PDF) 68 Page - STMicroelectronics

No. de pieza STM32F302XD
Descripción Electrónicos  CRC calculation unit
PDF  168 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F302XD Datasheet(HTML) 68 Page - STMicroelectronics

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Electrical characteristics
STM32F302xD STM32F302xE
68/168
DocID026900 Rev 4
6.3
Operating conditions
6.3.1
General operating conditions
Table 19. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
-
0
72
MHz
fPCLK1
Internal APB1 clock frequency
-
0
36
fPCLK2
Internal APB2 clock frequency
-
0
72
VDD
Standard operating voltage
-
2
3.6
V
VDDA
Analog operating voltage
(OPAMP and DAC not used)
Must have a potential
equal to or higher than
VDD
23.6
V
Analog operating voltage
(OPAMP and DAC used)
2.4
3.6
VBAT
Backup operating voltage
-
1.65
3.6
V
VIN
I/O input voltage
TC I/O
-0.3
VDD+0.3
V
TTa I/O
-0.3
VDDA+0.3
FT and FTf I/O(1)
1. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.
-0.3
5.5
BOOT0
0
5.5
PD
Power dissipation at TA =
85 °C for suffix 6 or TA =
105 °C for suffix 7(2)
2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section 7.7: Thermal
characteristics).
LQFP144
-
606
mW
WLCSP100
-
454
LQFP100
-
476
UFBGA100
-
339
LQFP64
-
435
TA
Ambient temperature for 6
suffix version
Maximum power
dissipation
-40
85
°C
Low power dissipation(3)
3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Section 7.7: Thermal characteristics).
-40
105
Ambient temperature for 7
suffix version
Maximum power
dissipation
-40
105
°C
Low power dissipation(3)
-40
125
TJ
Junction temperature range
6 suffix version
-40
105
°C
7 suffix version
-40
125



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