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MPC8535EBVTATH Datasheet(PDF) 32 Page - Freescale Semiconductor, Inc |
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MPC8535EBVTATH Datasheet(HTML) 32 Page - Freescale Semiconductor, Inc |
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32 / 126 page ![]() MPC8535E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2 DDR2 and DDR3 SDRAM Freescale Semiconductor 32 Table 14 provides the DDR capacitance when GVDD(type) = 1.8 V. Table 15 provides the current draw characteristics for MVREF. 2.6.2 DDR2 and DDR3 SDRAM Interface AC Electrical Characteristics This section provides the AC electrical characteristics for the DDR SDRAM Controller interface. The DDR controller supports both DDR2 and DDR3 memories. Please note that although the minimum data rate for most off-the-shelf DDR3 DIMMs available is 800 MHz, JEDEC specification does allow the DDR3 to run at the data rate as low as 606 MHz. Unless otherwise specified, the AC timing specifications described in this section for DDR3 is applicable for data rate between 606 MHz and 667 MHz, as long as the DC and AC specifications of the DDR3 memory to be used are compliant to both JEDEC specifications as well as the specifications and requirements described in this MPC8535E hardware specifications document. 2.6.2.1 DDR2 and DDR3 SDRAM Interface Input AC Timing Specifications Table 16 through Table 18 provide the input AC timing specifications for the DDR controller. Table 14. DDR2 SDRAM Capacitance for GVDD(typ)=1.8 V Parameter/Condition Symbol Min Max Unit Notes Input/output capacitance: DQ, DQS, DQS CIO 68 pF 1, 2 Delta input/output capacitance: DQ, DQS, DQS CDIO — 0.5 pF 1, 2 Note: 1. This parameter is sampled. GVDD = 1.8 V ± 0.090 V (for DDR2), f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V. 2. This parameter is sampled. GVDD = 1.5 V ± 0.075 V (for DDR3), f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.175 V. Table 15. Current Draw Characteristics for MVREF Parameter/Condition Symbol Min Max Unit Note Current draw for MVREFn DDR2 SDRAM IMVREFn — 1500 μA1 DDR3 SDRAM 1250 1.The voltage regulator for MVREF must be able to supply up to 500 μA or 1250 uA current for DDR2 or DDR3 respectively. Table 16. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface At recommended operating conditions with GVDD of 1.8 V ± 5% Parameter Symbol Min Max Unit AC input low voltage 667 VILAC —MVREF – 0.20 V <=533 — MVREF – 0.25 V AC input high voltage 667 VIHAC MVREF + 0.20 — V <=533 MVREF + 0.25 — V |
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