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AS1163 Datasheet(PDF) 13 Page - ams-OSRAM AG

No. de pieza AS1163
Descripción Electrónicos  Standalone intelligent driver
PDF  91 Pages
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Fabricante Electrónico  AMSOSRAM [ams-OSRAM AG]
Página de inicio  https://ams-osram.com/
Logo AMSOSRAM - ams-OSRAM AG

AS1163 Datasheet(HTML) 13 Page - ams-OSRAM AG

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AS1163
Absolute maximum ratings
Datasheet • PUBLIC • Document Feedback
DS001075 • v2-00 • 2025-Nov-21
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Absolute maximum ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. These are stress ratings only. Functional operation of the device at
these or any other conditions beyond those indicated under “Operating Conditions” is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3: Absolute maximum ratings of AS1163
Symbol
Parameter
Min
Max
Unit
Comments
Electrical parameters
VDD / VGND
Supply voltage to ground
-0.3
7
V
Referenced to GND
VIN
Input pin voltage to ground
-0.3
VDD+0.3
V
ISCR
Input current (latch-up
immunity)
± 100
mA
AEC-Q100-004
Continuous power dissipation (TA = 70 °C)
PT
Continuous power dissipation
600
mW
Continuous power dissipation (TA = 125 °C, VOUT = 2.5 V, RTH = 71.6 °C/W)
PT
Continuous power dissipation
300
mW
Electrostatic discharge
ESDHBM
Electrostatic discharge HBM
± 4
KV
AEC-Q100-002
ESDCDM
Electrostatic discharge CDM
± 500
V
AEC-Q100-011, ±750V for corner pins
Temperature ranges and storage conditions
TA
Operating ambient
temperature
-40
125
°C
TJ
Operating junction
temperature
-40
150
°C
TSTRG
Storage temperature range
-55
150
°C
TBODY
Package body temperature
260
°C
IPC/JEDEC J-STD-020(1)
RHNC
Relative humidity (non-
condensing)
5
85
%
MSL
Moisture sensitivity level
3
ICP/JEDEC J-STD-033
(1) The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow
Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.” The lead finish for Pb‑free leaded packages is
“Matte Tin” (100 % Sn).



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