MPC8535EBVTATH datasheet(112/126 Pages) FREESCALE

112 / 126 page

MPC8535E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2

Thermal

Freescale Semiconductor

112

The recommended attachment method to the heat sink is illustrated in Figure 73. The heat sink should be attached to the

printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45

Newton).

Figure 73. Package Exploded Cross-Sectional View with Several Heat Sink Options

The system board designer can choose between several types of heat sinks to place on the device. Ultimately, the final selection

of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass,

attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha

Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient

thermal resistances, that will allow the MPC8535E to function in various environments.

2.24.3.1

Internal Package Conduction Resistance

For the packaging technology, shown in Table 70, the intrinsic internal conduction thermal resistance paths are as follows:

•

The die junction-to-case thermal resistance

•

The die junction-to-board thermal resistance

Figure 74 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board.

Figure 74. Package with Heat Sink Mounted to a Printed-Circuit Board

Thermal Interface Material

Heat Sink

FC-PBGA Package

Heat Sink

Clip

Printed-Circuit Board

Die

External Resistance

Internal Resistance

Radiation

Convection

Radiation

Convection

Heat Sink

Printed-Circuit Board

Thermal Interface Material

Package/Solder Spheres

Die Junction

Die/Package

(Note the internal versus external package resistance)

MPC8535EBVTATH Datasheet(PDF) 112 Page - Freescale Semiconductor, Inc

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