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MPC8535EBVTATH Datasheet(PDF) 109 Page - Freescale Semiconductor, Inc

No. de pieza MPC8535EBVTATH
Descripción Electrónicos  PowerQUICC??III Integrated Processor Hardware Specifications
PDF  126 Pages
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Fabricante Electrónico  FREESCALE [Freescale Semiconductor, Inc]
Página de inicio  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8535EBVTATH Datasheet(HTML) 109 Page - Freescale Semiconductor, Inc

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Thermal
MPC8535E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
109
2.23.6
Frequency Options
2.23.6.1
SYSCLK to Platform Frequency Options
Table 78 shows the expected frequency values for the platform frequency when using a CCB clock to SYSCLK ratio in
comparison to the memory bus clock speed.
2.24
Thermal
This section describes the thermal specifications of the MPC8535E.
2.24.1
Thermal Characteristics
Table 79 provides the package thermal characteristics.
Table 78. Frequency Options of SYSCLK with Respect to Memory Bus Speeds
CCB to
SYSCLK Ratio
SYSCLK (MHz)
33.33
41.66
66.66
83
100
111
133.33
Platform /CCB Frequency (MHz)
3
333
400
4
333
400
444
5
333
415
500
6
400
500
8
333
10
333
417
12
400
500
Table 79. Package Thermal Characteristics
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Junction-to-ambient Natural Convection
Single layer board (1s)
RθJA
23
°C/W
1, 2
Junction-to-ambient Natural Convection
Four layer board (2s2p)
RθJA
18
°C/W
1, 2
Junction-to-ambient (@200 ft/min)
Single layer board (1s)
RθJA
18
°C/W
1, 2



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