S25FL256SDPNFAQ datasheet(42/149 Pages) CYPRESS

42 / 149 page

Document Number: 001-98283 Rev. *M

Page 41 of 148

S25FL128S/S25FL256S

6.3.2

FAB024 24-Ball BGA Package Physical Diagram

FAB024 — 24-Ball BGA (8 x 6 mm) Package

SHEET

REV

SPEC NO.

THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF CYPRESS

SEMICONDUCTOR CORPORATION. THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED WITHOUT WRITTEN CONSENT OF CYPRESS SEMICONDUCTOR CORPORATION.

CYPRESS

TITLE

SCALE :

Company Confidential

PACKAGE

CODE(S)

DRAWN BY

APPROVED BY

DATE

METALLIZED MARK INDENTATION OR OTHER MEANS.

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK,

N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, "SD" = eD/2 AND

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW, "SD" OR "SE" = 0.

POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.

"SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.

e REPRESENTS THE SOLDER BALL GRID PITCH.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE

BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.

DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994.

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS.

ALL DIMENSIONS ARE IN MILLIMETERS.

PARALLEL TO DATUM C.

NOTES:

0.35

0.00 BSC

1.00 BSC

0.40

0.45

0.20

4.00 BSC

6.00 BSC

8.00 BSC

1.20

0.00 BSC

DIMENSIONS

SYMBOL

MIN.

NOM.

MAX.

"SE" = eE/2.

FAB024

KOTA

BESY

18-JUL-16

002-15534

PACKAGE OUTLINE, 24 BALL FBGA

TO FIT

8.0X6.0X1.2 MM FAB024

S25FL256SDPNFAQ Datasheet(PDF) 42 Page - Cypress Semiconductor

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