| Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
MB89R112 Datasheet(PDF) 46 Page - RAMXEED LIMITED |
|
|
|||||||||||||||||||||||||||||
MB89R112 Datasheet(HTML) 46 Page - RAMXEED LIMITED |
|
46 / 49 page ![]() MB89R112 46 DS411-00004-3v0-E RECOMMENDED ASSEMBLY CONDITIONS (WAFER) The MB89R112 is recommended to be mounted in the following condition to maintain the data retention characteristics of the FeRAM memory when the chip is mounted. - Mounting temperature of 175 C or lower, and 120 minutes or shorter when applied at high temperature, or - Mounting temperature of 200 C or lower, and 60 seconds or shorter when applied at high temperature +175 +25 120 +200 +25 60 Time [min] Time [s] |
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |