CC1021-RTR1 datasheet(15/91 Pages) TI1

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CC1021

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SWRS045D – JANUARY 2006 – REVISED JANUARY 2015

4.12 Thermal Resistance Characteristics for VQFNP Package

NAME

DESCRIPTION

°C/W(1) (2)

RθJC(top)

Junction-to-case (top)

16.2

RθJB

Junction-to-board

6.9

RθJA

Junction-to-free air

30.7

PsiJT

Junction-to-package top

0.2

PsiJB

Junction-to-board

6.9

RθJC(bottom)

Junction-to-case (bottom)

1.0

(1)

°C/W = degrees Celsius per watt.

(2)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R

θJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

Specifications

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