AMD-K6-2ESLASH400AMZ datasheet(14/332 Pages) AMD

14 / 332 page

xiv

List of Tables

AMD-K6™-2E Processor Data Sheet

22529B/0—January 2000

Preliminary Information

Table 42. SMM Revision Identifier ...................................................222

Table 43. I/O Trap Doubleword Configuration ................................224

Table 44. I/O Trap Restart Slot .........................................................225

Table 45. Boundary Scan Bit Definitions .........................................233

Table 46. Device Identification Register .........................................234

Table 47. Supported Test Access Port (TAP) Instructions .............235

Table 48. DR7 LEN and RW Definitions ..........................................245

Table 49. Operating Ranges ..............................................................254

Table 50. Absolute Ratings ................................................................255

Table 51. DC Characteristics .............................................................256

Table 52. Typical and Maximum Power Dissipation

for OPN Suffix AMZ (Low-Power Devices) .....................258

Table 53. Typical and Maximum Power Dissipation

for OPN Suffix AFR (Standard-Power Devices) .............259

Table 54. Power Derating Specification for Standard-Power

Devices (AMD-K6-2E/233AFR and 266AFR) ..................260

Table 55. Power Derating Specification for Low-Power

Devices (AMD-K6-2E/233AMZ and 266AMZ) .................261

Table 56. CLK Switching Characteristics

for 100-MHz Bus Operation ...............................................268

Table 57. CLK Switching Characteristics

for 66-MHz Bus Operation .................................................268

Table 58. Output Delay Timings for 100-MHz Bus Operation ........270

Table 59. Input Setup and Hold Timings

for 100-MHz Bus Operation ...............................................272

Table 60. Output Delay Timings for 66-MHz Bus Operation ..........274

Table 61. Input Setup and Hold Timings for 66-MHz Bus Operation 276

Table 62. RESET and Configuration Signals

for 100-MHz Bus Operation ..............................................278

Table 63. RESET and Configuration Signals

for 66-MHz Bus Operation .................................................279

Table 64. TCK Waveform and TRST# Timing at 25 MHz ...............280

Table 65. Test Signal Timing at 25 MHz...........................................280

Table 66. Package Thermal Specification

for OPN Suffix AMZ (Low-Power Devices) .....................285

Table 67. Package Thermal Specification

for OPN Suffix AFR (Standard-Power Devices) .............285

Table 68. Passive Heatsink Samples.................................................289

Table 69. Socketed CPGA Package: Measured Thermal

Resistance (°C/W)

qJC and qCA .........................................291

Table 70. Socketed CPGA Package: Measured Maximum

Ambient Temperature (°C) ...............................................292

Table 71. Soldered CPGA Package: Measured Thermal

Resistance (°C/W)

qJC and qCA .........................................293

Table 72. Soldered CPGA Package: Measured Maximum

Ambient Temperature (°C) ...............................................294

Table 73. Valid Ordering Part Number Combinations ...................306

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