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MP2884A Datasheet(PDF) 5 Page - Monolithic Power Systems |
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MP2884A Datasheet(HTML) 5 Page - Monolithic Power Systems |
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5 / 107 page ![]() MP2884A – DIGITAL PWM CONTROLLER WITH PMBUS AND PWM-VID MP2884A Rev. 1.01 www.MonolithicPower.com 5 12/25/2018 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2018 MPS. All Rights Reserved. PIN FUNCTIONS (continued) Package Pin # Name Type (1) Description 33 TSNS/BOOT A [I/O] Thermistor thermal sensing input or boot voltage setting. TSNS/BOOT can be programmed for either thermistor thermal sensing or boot voltage setting. When used as TSNS, the controller compares the voltage of TSNS/BOOT to an internal programmable threshold. Once triggered, TALERT# is asserted, and the VR enters a pre-programmed protection mode. When used as BOOT, a voltage divider is required from VDD18 to TSNS/BOOT to set the boot voltage. 34 SDA D [I/O] PMBus data. 35 SCL D [I] PMBus clock. 36 EN D [I] Enable control. 37 PSI A [I] Power saving interface. 1.8V logic. When PSI is 1, all phases have forced continuous conduction mode (CCM). When PSI is 0, there is an adjustable low-phase count. When PSI is in Hi-Z, auto-phase-shedding is enabled. 38 PGOOD D [O] Power good indication. PGOOD is an open-drain output. PGOOD asserts when the output voltage is in regulation. 39 PWMVID A [I] PWM-VID signal input. PWMVID is a 1.8V logic. Connect the PWM- VID signal to PWMVID. The VR calculates the target VID based on the duty. 40 VTEMP A [I] Analog signal from the VR to the controller. VTEMP indicates the maximum temperature of the power stages. The MP2884A supports temperature sensing from the Intelli-Phase power stages. Tie all temperature reporting pins from the Intelli-Phase together to produce the maximum value on the VTEMP bus. PAD AGND Power Analog ground. NOTE: 1) A = analog, D = digital, I = input, O = output, I/O = bidirectional. ABSOLUTE MAXIMUM RATINGS (2) VDD33.......................................... -0.3V to +4.0V VDD18.......................................... -0.3V to +2.0V CS1~4, PWM1~4, VFB, VDIFF, VOSEN, VORTN, PGOOD, PSI, SCL, SDA, TSNS/BOOT, TALERT#, PWMVID, EN, VTEMP......................................... -0.3V to +4.0V CSSUM, IMON, IREF, VINSEN, ADDR .............. ...................................................... -0.3V to +2.0V Junction temperature ................................ 150°C Lead temperature...................................... 260°C Continuous power dissipation (3) ..............3.47W Recommended Operating Conditions (4) Supply voltage (VIN) ...................... +3.0V to 3.6V Operating junction temp. (TJ)....-40°C to +125°C Thermal Resistance (5) θJA θJC QFN-40 (5mmx5mm)............. 36 ....... 5 ....°C/W NOTES: 2) Exceeding these ratings may damage the device. 3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature. 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 6-layer PCB. |
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