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RZ/T1 Datasheet(PDF) 136 Page - Renesas Technology Corp

No. de pieza RZ/T1
Descripción Electrónicos  RZ/T1 Group
PDF  139 Pages
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Fabricante Electrónico  RENESAS [Renesas Technology Corp]
Página de inicio  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RZ/T1 Datasheet(HTML) 136 Page - Renesas Technology Corp

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R01DS0228EJ0200 Rev.2.00
Page 136 of 139
Jun. 30, 2025
RZ/T1 Group
1.60
Nov. 30, 2020
All
Registered trademark symbol added (Arm → Arm®)
All
Package name changed (HLQFP → HLFQFP)
Features
1
Note 3 deleted (renumbering the subsequent note numbers: Note 4 → Note 3, Note 5 → Note 4)
1. Overview
3
Table 1.1 Outline of Specifications (2 / 7): VIC, NVIC: Peripheral function interrupts: Number of
sources, modified
4
Table 1.1 Outline of Specifications (3 / 7): TPUa: The footnote number for the number of units,
modified
5
Table 1.1 Outline of Specifications (4 / 7): IWDTa: The unit of frequency, modified
12
Figure 1.1 Block Diagram: The number of MTU3a channels, modified
15
Table 1.4 Pin Functions (3 / 7): MTU3a: The function of pins MTIOC0m to MTIOC8m, modified
15
Table 1.4 Pin Functions (3 / 7): GPTa: The function of pins GTIOC0A, GTIOC0B to GTIOC3A,
and GTIOC3B, modified
17
Table 1.4 Pin Functions (5 / 7): ETHERC: The function of pin ETHSWSECOUT, modified
21
Figure 1.3 Pin Arrangement (176-pin HLFQFP): Note 2 added
2. Electrical Characteristics
55
Table 2.4 DC Characteristics (3) [Except for USB2.0 Host/Function-Related Pins]
The footnote number added: Three-state leakage current (off state) / 5-V tolerant pins / |ITSI| →
Three-state leakage current (off state) / 5-V tolerant pins*1 / |ITSI|
60
Table 2.12 CLKOUT25Mn Timing: CLKOUT25Mn (RMII) / CLKOUT25Mn frequency,
CLKOUT25Mn (MII) / CLKOUT25Mn frequency: The max. and min. values modified; index (n = 0
to 2) added
66
Table 2.17 Bus Timing (2 / 2): The border under "tWTS", deleted
72
Figure 2.17 SRAM Bus Cycle with Byte Selection (SW = 1 Cycle, HW = 1 Cycle, Asynchronous
External Wait 1 Inserted, BAS = 0 (Write Cycle UB#/LB# Control)): The title modified
73
Figure 2.18 SRAM Bus Cycle with Byte Selection (SW = 1 Cycle, HW = 1 Cycle, Asynchronous
External Wait 1 Inserted, BAS = 1 (Write Cycle WE# Control)): The title modified
94
Figure 2.41 TPUa Clock Input Timing: Text modified (TCLK0A to TCLK0D, TCLK1A to TCLK1D
→ TCLKA to TCLKD)
97
Figure 2.45 POEn# Input Pulse Timing: Index (n = 0, 4, 8, 10), added
103
Figure 2.53 RSPIa Timing (Master, CPHA = 0): Changed to the correct figure
110
Table 2.29 RIICa Timing: Note 4 modified
115
Table 2.32 ETHERC Timing: Index (n = 0 to 2), added
119
Table 2.33 Serial Management Interface: The entries modified (ETHn_MDC, ETHn_MDIO →
ETH_MDC, ETH_MDIO; Note added
123
Table 2.36 On-chip USB High-Speed Characteristics (USB_DP, USB_DM Pin Characteristics):
The header notation modified (Typ → typ)
1.70
May. 20, 2022 Section 1 Overview
10 to 12
Table 1.3 List of Products (1/3), (2/3), (2/3): Product type name, added
12
1.3 Product type name, added
1.80
Oct. 31, 2023
Features
1
Package PLBG0320GB-A, added
Section 1 Overview
8
Table 1.1 Outline of Specifications (7/7): Packages PRBG0320GB-A and PLBG0320GB-A, added
10
Table 1.3 List of Products (1/3): 320-pin BB package products (R7S910xxxCBB), added
11
Table 1.3 List of Products (2/3): 320-pin BB package products (R7S910xxxCBB), added
12
Table 1.3 List of Products (3/3): 320-pin BB package products (R7S910xxxCBB), added
13
1.3 Product type name: Package type: BB (PLBG0320GB-A), added
Rev.
Date
Description
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