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AMD-K6-2E/400AMZ Datasheet(PDF) 312 Page - Advanced Micro Devices |
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AMD-K6-2E/400AMZ Datasheet(HTML) 312 Page - Advanced Micro Devices |
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312 / 332 page ![]() 294 Thermal Design Chapter 16 AMD-K6™-2E Processor Data Sheet 22529B/0—January 2000 Preliminary Information Soldered Installation: Maximum Ambient Temperature Table 72 and Figure 108 show the measured maximum ambient temperature (TA) values in °C at different levels of airflow in the system for the low-power embedded AMD-K6-2E processors with a maximum thermal power dissipation of 10.0 watts (for OP Ns: AMD-K6-2E/26 6A MZ , AM D- K6 -2E/300 AMZ, and AMD-K6-2E/333AMZ) and a maximum case temperature rating of 85 °C, in the 321-pin Ceramic Pin Grid Array package (CPGA) when soldered into a printed circuit board. . Figure 108. Measured Maximum Ambient Temperature (Soldered, 321-Pin CPGA Package) Table 72. Soldered CPGA Package: Measured Maximum Ambient Temperature (°C) Heatsink Type Maximum TA (°C) v. Airflow (m/s) 0.0 m/s 1.0 m/s 2.0 m/s 3.0 m/s 4.0 m/s No Heatsink 14 °C 31 °C 42 °C 53 °C 58 °C A (15 mm) 33 °C 51 °C 61 °C 66 °C 68 °C B (20 mm) 36 °C 56 °C 65 °C 70 °C 72 °C C (30 mm) 42 °C 60 °C 69 °C 71 °C 73 °C TC = 85°C, Pd = 10 W 0 10 20 30 40 50 60 70 80 01234 Airflow Rate (m/s) 1RQH $ % & |
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